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COMPONENT REFLOW / PACKAGING SYSTEMS

 
VLO 20 VLO 180 | VLO 300
Bulletin # 12-0125- A Product Bulletin # 12-0822

 

VLO 20


Vacuum Soldering System for
R&D and small volume production

The Centrotherm VLO 20 vacuum soldering system meets the highest demands of R&D departments as well as the needs of small production facilities which use vacuum to achieve voidless soldering joints.

With VLO 20, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.

This system is ideal for production facilities which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). The Centrotherm VLO 20 optionally provides wet chemical activation with HCOOH or dry chemical activation with MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.

Features

  • Process temperature up to 450°C
  • Excellent temperature uniformity
  • Heating ramp up to 50° K/min
  • Cooling rate up to 180° K/min
  • Vacuum level up to 10-5 mbar
  • Very short cycle time

Applications

  • Advanced Packaging
  • Power Semiconductors
  • Sealing
  • Soldering

 

VLO 180 | VLO 300


Vacuum Soldering Systems for High Volume Production

The Centrotherm VLO 180 and VLO 300 vacuum soldering systems are ideally suited for high volume production facilities with various materials at up to 650°C.

The integrated heating and cooling plates can be individually controlled. With VLO 180 and VLO 300, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.
The system is ideally suited for production facilities which run fluxless and voidless soldering processes with various gas atmospheres (N2, H2 100, N2/H295/5). Wet chemical activation with HCOOH or dry chemical activation with MW plasma for ultra clean soldering joints are optionally available. Even lead free paste or pre-forms can be used without additional flux.   
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.

Features

  • Process temperature up to 650°C
  • Excellent temperature uniformity
  • Heating ramp up to 40° K/min
  • Cooling rate up to 180° K/min
  • Vacuum level up to 10.1 mbar
  • Very high throughput
  • Large process area
    • VLO 180: 0.66 m2 (1 in.2)
    • VLO 300: 1.1 m2 (1.7 in.2)

Applications

  • Advanced Packaging
  • Power Semiconductors
  • Sealing
  • Soldering

Product Bulletin # 12-0822
Centrotherm
Capacity and Throughput Calculator

  • VLO-20 has platen size of 9”x 16” and a load/unload and typical process run-time of 20 minutes which equates to capacity/throughput time of 3 runs per hour or 432 square inches per hour.

  • VLO-180 has 3 platens of 17”x 22” and load/unload and typical process run-time of 55-60 minutes which equates to 1122 square inches per run per hour: NOTE: Each platen in the VLO-180 can be independently programmed for a different reflow temperature profile.

    This allows you to simultaneously run 3 different device types temperature profiles simultaneously in a single run (maximum temperature delta per platen must not exceed 125⁰c).
VLO-300 has 5 platens of 17”x 22” for a total of 1870 inches per run time of 55-60 minutes which equates to a capacity/throughput time of 1870 square inches per hour.  NOTE: Each platen in the VLO-300 can be independently programmed for a different reflow temperature profile.

This allows you to simultaneously run 5 different device type temperature profiles simultaneously in a single run (maximum temperature delta per each platen must not exceed 125⁰c).

 

 

Bulletin # 12-0125- A

Advantages of Centrotherm’s VLO-Systems
Over Belt Furnaces

  1. Dramatically reduces operating costs: VLO-Systems only consume power and process gasses when they are running a reflow process. Belt furnaces must be kept running to maintain profile and consume power and process chemistry on a 24/7 basis.
  1. Higher Yields: are realized by VLO-System’s hermetic process chamber that provide pressure differential process steps to eliminate voids and to provide uniform and densified process chemistry environments to pristinely clean all wetting surfaces of each product.
  1. Higher Yields: every reflow process is product specific and process optimized to insure consistent reflow quality. Belt furnaces, however, are forced to use a compromise program to run various product which jeopardizes optimum reflow results
  1. Minimum floor space requirements all VLO-Systems occupy far less floor space than belt furnaces.
  1. Reduced labor costs with a single load-unload station. Belt furnace equipment usually requires separate operator functions at the input and output ends of the furnace.
  1. Dramatically reduced tooling/fixturing costs are the result of employing simpler, smaller and less expensive “templates” (ref bulletin # 09-02,. that, set for set, are 1/10th the price of belt furnace tooling.
  1. Flux contamination is eliminated: In-vessel pressure differential process steps that also provide densified process chemistry result in pristine wetting surfaces which eliminates the need for flux, (a contaminant) and provides consistent, optimum and void free reflow.
  1. Versatility: All VLO-Systems are quickly key board programmable to transfer a product specific and optimized process to each product run to maximize yields. All VLO-Systems have a program library capacity of 1000 process recipe’s, or more.
  1. Versatility: Utilizing the VLO-180 and 300 multiple platen system an operator can simultaneously run a separate temperature/reflow cycle on each of the 3 or 5 platens of the two systems.

Summary

All Centrotherm “VLO” systems are more cost and floor space effective, more versatile, promote higher yields with less labor costs and can provide a rapid return-on-investment over a customers existing belt furnace reflow system.